According to Mr James
consulting report, 2015 3D sensor market size of $1 billion 60 million, is expected to grow at a compound annual rate of 26.5% between 2016~2022 years, will reach $5 billion 460 million in 2022. The market growth drivers come from: consumer electronics demand for 3D sensors; integration of optical and electronic devices; sensing technology in the gaming field; the growing security and monitoring system requirements. The research year of this report is 2015, the forecast period is 2016~2022 years.
during 2016~2022, compared to other sensors, 3D image sensor is expected to grow at a higher rate. 3D image sensor helps to realize the data in 3D format, which makes the analysis of object size and processing related data becomes easier. Because 3D image sensor can not only capture images, but also provide three-dimensional measurement data, so it has a wide range of applications in various fields.
based flight time technology 3D sensor market is growing, thanks mainly to its ease of use and more and more applications. The 3D sensor sends the light pulses to the target continuously, and then receives the light from the object with the sensor, and the target distance is detected by detecting the flying time of the optical pulse.
2016~2022 years, entertainment applications will grow at second speed. This mainly benefited from the field of augmented reality / virtual reality, motion detection, gesture recognition growth in demand.
2015, North America accounted for the largest share of the global 3D sensor market, while the fastest growing Asia Pacific region in 2016~2022. The demand for advanced technology and equipment in the Asia Pacific region is increasing; in addition, 3D sensors are used in higher rates: consumer electronics, manufacturing, entertainment.
2016~2022 3D sensor market (by region segmentation) ecosystem
3D sensor market including suppliers of raw materials, device manufacturers, technology service providers, software solutions providers, original equipment manufacturers (OEM). Participate in the development of 3D sensor companies including Taiwan ASUS (ASUSTeK), the United States Cognex (Cognex), Germany (Infineon), Infineon Intel (Intel), German IFM (IFM), Canada LMI, Technologies microchip technology (Microchip Technology), Microsoft (Microsoft), the United States, the United States Occipital Howell science and Technology (OmniVision Technologies), Germany PMD Technologies, Qualcomm (Qualcomm) and SoftKinetic of belgium.
this report's main research contents:
-, according to the type of technology, application and geographic distribution, definition, description and prediction of the 3D sensor market.
- for four major regions (North America, Europe, Asia Pacific, the rest of the world), to predict the size of each market segments.
- describes key factors affecting the market growth of 3D sensors (drivers, constraints, opportunities, industry challenges).
- strategic analysis of the micro market according to industry growth trends, future prospects, and contribution to the overall market.
- provides a detailed analysis of the value chain of the 3D sensor market, and using Potter's five forces model to analyze market trends.
- by screening 3D sensor market growth areas, to analyze the opportunities of various stakeholders.
- strategically introduces major vendors of 3D sensors, a comprehensive analysis of their core competencies and market rankings, while detailing the competitive landscape of market leaders.
- analysis of 3D sensor industry competitive landscape, such as partners and joint ventures, mergers and acquisitions, new product development, technical research and development.
this report research scope:
- subdivided according to the type of image sensor
- position sensor
- acoustic sensor
- acceleration sensor
/>- other according to the technology of subdivision:
- stereo vision
- structure light
- time of flight
according to the application of ultrasonic />- subdivision:
- consumer electronics
- aerospace and defense
- industrial robot
- security and monitoring
according to the
- area subdivision: North America
- Asia Pacific
- in other parts of the world
"3D sensor if necessary The -2016 version of the book "the market report, please E-mail:wangyi#memsconsulting.com (@ # replaced).
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